Abstract: In order to solve the problems of long measurement preparation cycle, heavy workload, difficulty in fault location, and tight experimental space caused by long cable, large volume and complex process in the process of strain measurement, a wireless acquisition system based on ultra-thin chip packaging technology is developed. The system has the advantages of small volume, less cable, nearby acquisition, conformal body and convenient installation. The application verification of the system is conducted in the fatigue test of MA600, and good results have been achieved, which shows that the system can meet the requirements of the test.