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小麦高配对材料CS-PhI的鉴定

Identification of High Pairing Material CS-PhI in Wheat

  • 摘要: 为明确小麦高配对材料CS-PhI的染色体组成,采用基因组原位杂交和重复序列为探针的荧光原位杂交技术,进行分子细胞遗传学鉴定。利用23个不同毒性的小麦白粉菌菌株对小麦高配对材料CS-PhI进行抗白粉病基因推导,以混合菌株进行成株期白粉病抗性鉴定。结果表明,CS-PhI中易位染色体为小麦染色体6B与拟斯卑尔脱山羊草的双末端小片段易位。CS-PhI与Pm4c或Pm3b的抗谱有些相似,成株期表现对白粉病免疫,CS-PhI可用于小麦白粉病抗病育种,其是否为新的基因还需进行综合分析研究。

     

    Abstract: In order to clarify the chromosome composition of wheat high pairing material CS-PhI, genomic in situ hybridization and fluorescence in situ hybridization were used for molecular cytogenetic identification. The powdery mildew resistance gene of wheat high pairing material CS-PhI was derived by 23 different powdery mildew strains with different virulence, and the powdery mildew resistance was identified by inoculating with mixed strains at the adult stage. The results showed that the translocation chromosome of CS-PhI was a biterminal small fragment translocation between Triticum aestivum chromosome 6B and Aegilops speltoides. The resistance spectrum of CS-PhI was similar to Pm4 c or Pm3 b, and it was immune to powdery mildew at the adult plant stage. CS-PhI could be used in wheat powdery mildew resistance breeding, but whether it was a new gene needs to be comprehensively analyzed and studied.

     

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