Abstract: In order to comprehensively evaluate the cooling effect of the liquid cooling plate of SiC power module,three kinds of cold plate runner structures in series,parallel and series parallel were designed.The cold plate performance was evaluated from 10 indicators of device temperature rise,system energy efficiency and heat dissipation performance.The steady-state distribution characteristics of the flow field and temperature field of the liquid cooling system were analyzed based on ICEPAK simulation.From the perspective of energy saving,the project application selection and optimization of liquid cooling scheme were given.The results show that the temperature rise and heat dissipation performance indexes of the series runner design are best,but its energy efficiency coefficient of performance is only 1/5 of that of the parallel design.The improvement of heat dissipation performance reduces the energy efficiency at the cost of increasing the pressure loss inside the cold plate.For the three runner designs,the coolant flow rate is increased from 8.2 L/min to 24.6 L/min,and the energy efficiency coefficient of the cold plate are decreased from 1 275,6 407,and 1 425 to 53.2,258.3,and 60.6,respectively.Increasing the coolant flow rate is not the first choice to improve heat dissipation.In practical engineering applications,within the allowable range of temperature rise of the device,the parallel runner design and the parallel heat dissipation scheme between multiple cold plates should be preferred,so as to improve the energy saving of the heat dissipation system.